Description
Substrate Surface Mount (Passive Component, Boat) [oS]Configuration
No ConfigurationOEM Model Description
The SIPLACE CA (Chip Assembly) platform can place bare dies directly from wafers, using the die attach or flip chip process. It supports the entire SMT placement capabilities provided by the SIPLACE X Series. The SIPLACE CA can be used for direct die attach or SMD only or in mixed applications to place bare dies along with SMD components in a single pass process.Documents
No documents
Verified
CATEGORY
Pick and Place
Last Verified: 25 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
151384
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT / SIEMENS
SIPLACE CA
CATEGORY
Pick and Place
Last Verified: 25 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
151384
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Substrate Surface Mount (Passive Component, Boat) [oS]Configuration
No ConfigurationOEM Model Description
The SIPLACE CA (Chip Assembly) platform can place bare dies directly from wafers, using the die attach or flip chip process. It supports the entire SMT placement capabilities provided by the SIPLACE X Series. The SIPLACE CA can be used for direct die attach or SMD only or in mixed applications to place bare dies along with SMD components in a single pass process.Documents
No documents