Description

450mm wafer capable, Load-Lock Chamber

Configuration

Oxford PlasmaPro NGP1000 PECVD - Load Locked Chamber - System PC, Keyboard, Mouse - Windows 7 w/ PC4000 Control Software - X20 PLC - 490mm Diameter Aluminum Lower Electrode - Capable of running up 450mm wafers - Up to 400 degrees Celcius - Chamber Heating Kit (Heats Chamber Sidewalls to Minimize Process Deposition) - Dual Frequency RF with Pulsing for Film Stress Control - 600W 13.56Mhz HF RF Generator - 600W 2Mhz LF RF Generator - Pneumatic Chamber Lift Kit - Adixen ADS602P Dry Pump for Process Chamber - Adixen ACP40G for Load Lock - Operations Manual and Documentation X20 External Gas Box with up to 12 Gas Lines. Currently Configured for: - He - CF4 - N2 - N20 - NH3 - SiH4-N2

OEM Model Description

The PlasmaPro NGP1000 from Oxford Instruments is a tool that uses plasma etching and deposition to deposit layers of SiO2 and SiNx. It is part of the PlasmaPro NGP1000 HBLED series of tools. The system features a large electrode and a specially designed showerhead, which allows it to accommodate up to 61 x 2”, 15 x 4” or 7 x 6” wafers at once. This tool is specifically designed to provide exceptional advantages for manufacturers of HBLEDs.