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OXFORD PLASMALAB 800 PLUS
    Description
    Reactive Ion Etching Machine Frequency: 50/60HZ Voltage: 415VAC 3PHASE Full Load Amps:25.6Amps Machine Main Breaker Rating:32Amps Ampere Rating Of Largest Load:20Amps Interupt Current:4500 A.I.C Configuration: Nitride and Oxide Deposition Batch process tool, 18" platen  RF Components: ENI:  ACG - 5 XL , RF generator, 13.56MHZ, 500W ENI:  LPG - 6A , RF generator, 90kHz to 460kHz, 600W ATX-600 impedence matching network 450mm Platen with 300°C+ heater Windows PC , user friendly interface Gas pod with 6 lines including following MFCs: N2 – 1000sccm N2O – 100sccm N2O – 2000sccm NH3 – 100sccm SiH4 – 2000sccm  Gases Previously Used were the Following:  N2O , N2, NH3, SiH4  The tool is compact and very simple for operation. Footprint is 36"W x 42"D x 54" H. The chamber is on the top. The power supply, etc. are in the front and accessible behind a stainless steel panel. There is no load lock. You open the chamber, load one or more 4" substrates, close the chamber, and start the chamber pump down. Once the desired vacuum level is achieved, It is ready to run deposition process.
    Configuration
    Reactive Ion Etching Machine
    OEM Model Description
    The PlasmaPro 800Plus is a plasma etch and deposition solution that offers a large area for processing. It features an open loading design, making it easy to use and convenient to site, all while maintaining a compact footprint. The system is capable of handling full 300mm wafers or large batches of 43 x 50mm (2”) wafers, thanks to its 380mm or 460mm diameter table. This makes the PlasmaPro 800Plus a well-proven market-leading product that offers full production solutions without compromising on process quality.
    Documents
    verified-listing-icon

    Verified

    CATEGORY
    PECVD

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Installed / Idle


    Product ID:

    131557


    Wafer Sizes:

    Unknown


    Vintage:

    2007


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    OXFORD PLASMALAB 800 PLUS

    OXFORD

    PLASMALAB 800 PLUS

    PECVD
    Vintage: 0Condition: Used
    Last VerifiedOver 30 days ago

    OXFORD

    PLASMALAB 800 PLUS

    verified-listing-icon
    Verified
    CATEGORY
    PECVD
    Last Verified: Over 60 days ago
    listing-photo-599564fdc23e45339a0e944218345ba7-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/89425/131557/8e7eaabe40ff4fe9ab51d973e93bbcbb_c4080b1ce57848f2bb4408d05b25863519_mw.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Installed / Idle


    Product ID:

    131557


    Wafer Sizes:

    Unknown


    Vintage:

    2007


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Reactive Ion Etching Machine Frequency: 50/60HZ Voltage: 415VAC 3PHASE Full Load Amps:25.6Amps Machine Main Breaker Rating:32Amps Ampere Rating Of Largest Load:20Amps Interupt Current:4500 A.I.C Configuration: Nitride and Oxide Deposition Batch process tool, 18" platen  RF Components: ENI:  ACG - 5 XL , RF generator, 13.56MHZ, 500W ENI:  LPG - 6A , RF generator, 90kHz to 460kHz, 600W ATX-600 impedence matching network 450mm Platen with 300°C+ heater Windows PC , user friendly interface Gas pod with 6 lines including following MFCs: N2 – 1000sccm N2O – 100sccm N2O – 2000sccm NH3 – 100sccm SiH4 – 2000sccm  Gases Previously Used were the Following:  N2O , N2, NH3, SiH4  The tool is compact and very simple for operation. Footprint is 36"W x 42"D x 54" H. The chamber is on the top. The power supply, etc. are in the front and accessible behind a stainless steel panel. There is no load lock. You open the chamber, load one or more 4" substrates, close the chamber, and start the chamber pump down. Once the desired vacuum level is achieved, It is ready to run deposition process.
    Configuration
    Reactive Ion Etching Machine
    OEM Model Description
    The PlasmaPro 800Plus is a plasma etch and deposition solution that offers a large area for processing. It features an open loading design, making it easy to use and convenient to site, all while maintaining a compact footprint. The system is capable of handling full 300mm wafers or large batches of 43 x 50mm (2”) wafers, thanks to its 380mm or 460mm diameter table. This makes the PlasmaPro 800Plus a well-proven market-leading product that offers full production solutions without compromising on process quality.
    Documents
    Similar Listings
    View All
    OXFORD PLASMALAB 800 PLUS

    OXFORD

    PLASMALAB 800 PLUS

    PECVDVintage: 0Condition: UsedLast Verified:Over 30 days ago
    OXFORD PLASMALAB 800 PLUS

    OXFORD

    PLASMALAB 800 PLUS

    PECVDVintage: 1998Condition: UsedLast Verified:Over 60 days ago
    OXFORD PLASMALAB 800 PLUS

    OXFORD

    PLASMALAB 800 PLUS

    PECVDVintage: 2011Condition: UsedLast Verified:Over 30 days ago