Description
-Recently de-installed, but not operational (there is a wafer transport issue) -Full gas cabinet includedConfiguration
Oxford Plasmalab 100 PECVD: -Configured for 200mm wafers, with Al carrier for multiple substrate sizes, down to small pieces -Used for deposition of SiO2 and Si3N4 -Optional low-frequency power supply (configured with dual-frequency RF) -Heated stage; Routinely ran at 370 degrees -MFCs for 7 gases - Ar, CF4/O2, SiH4, N2O, CH4, PH3/TMP, and B2H6/TMBOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
No documents
Verified
CATEGORY
PECVD
Last Verified: 7 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106186
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
2001
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
OXFORD
PLASMALAB 100 PECVD
CATEGORY
PECVD
Last Verified: 7 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106186
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
2001
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
-Recently de-installed, but not operational (there is a wafer transport issue) -Full gas cabinet includedConfiguration
Oxford Plasmalab 100 PECVD: -Configured for 200mm wafers, with Al carrier for multiple substrate sizes, down to small pieces -Used for deposition of SiO2 and Si3N4 -Optional low-frequency power supply (configured with dual-frequency RF) -Heated stage; Routinely ran at 370 degrees -MFCs for 7 gases - Ar, CF4/O2, SiH4, N2O, CH4, PH3/TMP, and B2H6/TMBOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
No documents