Description
No descriptionConfiguration
PECVD Configured: 200 mm Process: PECVD & TEOS Controller Type: PC Loadlock Loadlock Pump: Alcatel APT 80 Turbo, ACT 200T Controller RF Generator: Advanced Energy LF5 & Advanced Energy RFX 600A Ten Process Gas Inputs with MFCs CF4 80%, O2 20%–500 SCCM—MKS 1179A Ar 90%, PH3 10%–50 SCCM—MKS 1479A Ar 90%, GeH4 10%–50 SCCM—MKS 1479A Ar 90%, BeH6 10%–50 SCCM—MKS 1479A N2 95%, SiH4 5%–1 SLM—MKS 1479A NH3 100%–100 SCCM—MKS 1479A N2O 100%–3 SLM—MKS 1179A N2O 100%–200 SCCM MKS 1179A N2 100%–2 SLM MKS 1179A O2 100%–500 SCCM MKS 1179AOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
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OXFORD
PLASMALAB 100
Verified
CATEGORY
PECVD
Last Verified: 6 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113537
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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OXFORD
PLASMALAB 100
CATEGORY
PECVD
Last Verified: 6 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113537
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
PECVD Configured: 200 mm Process: PECVD & TEOS Controller Type: PC Loadlock Loadlock Pump: Alcatel APT 80 Turbo, ACT 200T Controller RF Generator: Advanced Energy LF5 & Advanced Energy RFX 600A Ten Process Gas Inputs with MFCs CF4 80%, O2 20%–500 SCCM—MKS 1179A Ar 90%, PH3 10%–50 SCCM—MKS 1479A Ar 90%, GeH4 10%–50 SCCM—MKS 1479A Ar 90%, BeH6 10%–50 SCCM—MKS 1479A N2 95%, SiH4 5%–1 SLM—MKS 1479A NH3 100%–100 SCCM—MKS 1479A N2O 100%–3 SLM—MKS 1179A N2O 100%–200 SCCM MKS 1179A N2 100%–2 SLM MKS 1179A O2 100%–500 SCCM MKS 1179AOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
No documents