Description

No description

Configuration

Wafer Shape: SNNF EMO Type: Turn to Release CE Safety Mark: English Chamber Configuration: Chamber A: Producer S USG Twin . Chamber B: Producer S USG Twin. Chamber C: Producer S USG Twin. Electrical Configuration: Line Voltage: 208V Full Load Current:300 A Frequency: 50/60Hz Loadlock Configuration: Cassette Type: 200mm Fast Vent Option: Yes Mainframe Configuration: Producer Buffer Robot Type: VHP FI Robot type: PRI 407 Buffer Robot Blade: NA Status Light Tower: NA Mainframe: Front end Type: manual Type Front end Front end Robot : PRI 407 Buffer robot : VHP Transfer Pump : IPX Pump 180 Chamber Slit valve/LL door : VAT L/L Gauge :MKS stand Hard disk : NA Floppy disk : NA Chiller : NA Ozone rack :NA Gas panel Configuration: USG Vacuum System: NA CHA Chamber System Configuration: Chamber Parts: Gas feedthrough Assy. (used) Gas box (used ) Faceplate (used) Others Parts : NA Heater / TC : YES /NA Pressure Gauge :MKS 20 Torr / NA MKS 50Torr switch RF power : RF Gen type: NA match type: : NA RPS type: NP (New power plasma) CHB Chamber System Configuration: Chamber Parts: Gas feedthrough Assy. (used) Gas box (used ) Faceplate (used) Others Parts : NA Heater / TC : YES /NA Pressure Gauge : NA/ NA MKS 550 Torr switch RF power : RF Gen type: NA match type: : NA RPS type: NP (New power plasma) CHC Chamber System Configuration: Chamber Parts: Gas feedthrough Assy. (used) Gas box (used ) Faceplate (used) Others Parts : NA Heater / TC : YES / NA Pressure Gauge :MKS 10 Torr / MKS1000 Torr MKS 50 Torr switch RF power : RF Gen type: NA match type: : NA RPS type: NA

OEM Model Description

Applied Materials offers the Producer S system designed to deliver the same high productivity and throughput benefits as the first generation Producer with up to a 29% reduction in footprint. The significantly reduced footprint allows a greater number of Producer S tools to be facilitized in the cleanroom, resulting in lower COO and higher throughput per unit of fab space.