The soldering chamber has been enlarged to 750 x 620 mm. Both smaller assemblies up to a load of four in the batch and larger assemblies up to the maximum size of the soldering chamber can be processed.

The goal is to develop and produce advanced and innovative vapor phase reflow soldering systems and to offer our customers a simple and high quality soldering process in the process. Vapor as an energy transfer medium is one of the most effective methods for heating assemblies. The efficiency is many times higher than, for example, heating by convection. 

VP2100-100

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