Overview

ASSCON Vapour-Phase-Reflow-Soldering Systems set the benchmark in soldering technology. The physical laws of the process permit defect-free soldering of the most complicated SMT assemblies in any required geometry even when using lead-free solder pastes.Components such as QFPs, BGAs, Flip-Chips as well as hybrids are processed with very high quality results. The QUICKYSeries is designed to be used in the laboratory and for prototype production.