Description
[2nd SOURCE NEW ONLY] Core Features & Properties Type: Plasma Chuck Assembly (C-Chuck). Wafer Size: Optimized for 200mm (8-inch) platforms. Compatibility: Designed for Centura and Precision 5000 (P5000) series. Material: High-durability ceramic/metal composite engineered for vacuum plasma environments. Process Application Etch & PECVD: Ideal for plasma-enhanced processes requiring stable wafer clamping and RF grounding. Durability: High resistance to plasma erosion and chemical corrosion.Configuration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents
CATEGORY
Parts
Last Verified: 5 days ago
Key Item Details
Condition:
New
Operational Status:
Deinstalled
Product ID:
145691
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
0010-02737
CATEGORY
Parts
Last Verified: 5 days ago
Key Item Details
Condition:
New
Operational Status:
Deinstalled
Product ID:
145691
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
[2nd SOURCE NEW ONLY] Core Features & Properties Type: Plasma Chuck Assembly (C-Chuck). Wafer Size: Optimized for 200mm (8-inch) platforms. Compatibility: Designed for Centura and Precision 5000 (P5000) series. Material: High-durability ceramic/metal composite engineered for vacuum plasma environments. Process Application Etch & PECVD: Ideal for plasma-enhanced processes requiring stable wafer clamping and RF grounding. Durability: High resistance to plasma erosion and chemical corrosion.Configuration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents