Features:
-A specially designed vacuum system that draws tape away from the die while supporting the die on the grid.
-Die maintain position until easily picked up with a hand held vacuum tool.
-Particularly good for use on thin die and laser bars.
-Works with UV curable and pressure sensitive tapes.
-Can be mounted on SSEC Pick & Place System Model 835

SEMICONDUCTOR EQUIPMENT CORP. (SEC)

A complete system includes a Die Ejector Grid (suitable for die which are at least 3mm or larger on one side) mounted to a combination warming plate and vacuum chamber. A separate console houses a temperature controller, vacuum switch and power switch (see exploded view). Individual parts of the system can also be purchased separately.
In operation, a sawed or scribed wafer, mounted on a film frame or ring set, is placed over the grid, consisting of a series of closely spaced points. Vacuum and a low temperature (approximately 170°F) are applied through the grid to the back side of the wafer mounting tape. The vacuum pulls the tape from the back of the wafer into the valleys between the rows of points. Lifting the die from the tape with a tweezers, vacuum pencil or vacuum collet, is then a very simple matter. The Model 4800 will accommodate all film frames or ring mounting sets.

4800

semiconductorequipment4800sn48001277dieejector.jpg

semiconductorequipment4800sn48001277dieejector2.jpg

SEMICONDUCTOR EQUIPMENT CORP. (SEC)

4800

Packaging

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4800

Packaging

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