SEMICONDUCTOR EQUIPMENT CORP. (SEC)

3150

3250	

A complete system includes a Die Ejector Grid (suitable for die which are at least 3mm or larger on one side) mounted to a combination warming plate and vacuum chamber. A separate console houses a temperature controller, vacuum switch and power switch (see exploded view). Individual parts of the system can also be purchased separately.
In operation, a sawed or scribed wafer, mounted on a film frame or ring set, is placed over the grid, consisting of a series of closely spaced points. Vacuum and a low temperature (approximately 170°F) are applied through the grid to the back side of the wafer mounting tape. The vacuum pulls the tape from the back of the wafer into the valleys between the rows of points. Lifting the die from the tape with a tweezers, vacuum pencil or vacuum collet, is then a very simple matter. The Model 4800 will accommodate all film frames or ring mounting sets.

SEMICONDUCTOR EQUIPMENT CORP. (SEC)

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3150

4800

3250

3100

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