Description
No descriptionConfiguration
CE and ESD N51M M24 compliant 150mm and 200mm wafer diameter processing capability with matching wafer tables Double loadport (2 FOUP loader with 8" mapping, no 6" mapping) BG-Tape cutting and wafer handling using 6-axis robot Non-contact alignment and tape lamination unit Log file download function via LAN Ionizers for ceiling and loadport Manual on paper and digital download in english Preparation for Wafer ID reading function for front side only (reader not included) SECS/GEM Specification (license fee, no customization) PP_SELECT data variable length (software function) Wafer ID reading as task parameter No. 43 (software function) SECS/GEM menu only accessible with PW (software function) Maintenance password "ADWILL2" Total counter reset with max. wafer count 999.999.999 Counter reset with password N2 purge during lamination Wafer thickness limit changed to 3000μm Wafer table cleaning unit Pneumatic tape winder Vacuum cleaner value display on TouchpanelOEM Model Description
None ProvidedDocuments
No documents
LINTEC
RAD-3510F/12
Verified
CATEGORY
Packaging
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Idle
Product ID:
89447
Wafer Sizes:
Unknown
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
LINTEC
RAD-3510F/12
CATEGORY
Packaging
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Idle
Product ID:
89447
Wafer Sizes:
Unknown
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
CE and ESD N51M M24 compliant 150mm and 200mm wafer diameter processing capability with matching wafer tables Double loadport (2 FOUP loader with 8" mapping, no 6" mapping) BG-Tape cutting and wafer handling using 6-axis robot Non-contact alignment and tape lamination unit Log file download function via LAN Ionizers for ceiling and loadport Manual on paper and digital download in english Preparation for Wafer ID reading function for front side only (reader not included) SECS/GEM Specification (license fee, no customization) PP_SELECT data variable length (software function) Wafer ID reading as task parameter No. 43 (software function) SECS/GEM menu only accessible with PW (software function) Maintenance password "ADWILL2" Total counter reset with max. wafer count 999.999.999 Counter reset with password N2 purge during lamination Wafer thickness limit changed to 3000μm Wafer table cleaning unit Pneumatic tape winder Vacuum cleaner value display on TouchpanelOEM Model Description
None ProvidedDocuments
No documents