Description
Silicon wafers, apply back grinding protective tape (BG Tape) to the front side of the wafer before the back grinding (BG) process. Function of polishing tape: Protects the front circuitry during wafer thinning and polishing, prevents chipping, and blocksConfiguration
No ConfigurationOEM Model Description
LINTEC RAD-3500 F/12 is a Packaging system. The RAD-3500 F/12 can produce wafer size of 12”.Documents
No documents
Verified
CATEGORY
Packaging
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
150299
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LINTEC
RAD-3500 F/12
CATEGORY
Packaging
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
150299
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Silicon wafers, apply back grinding protective tape (BG Tape) to the front side of the wafer before the back grinding (BG) process. Function of polishing tape: Protects the front circuitry during wafer thinning and polishing, prevents chipping, and blocksConfiguration
No ConfigurationOEM Model Description
LINTEC RAD-3500 F/12 is a Packaging system. The RAD-3500 F/12 can produce wafer size of 12”.Documents
No documents