Description
Film Thickness MeasuremenyConfiguration
No ConfigurationOEM Model Description
The FilmTek™ 2000M TSV metrology system provides an unmatched combination of speed and accuracy for advanced semiconductor packaging applications. This system delivers best-in-class measurement performance and precision for high-throughput measurements for various packaging processes and related structures, including characterizing resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, and redistribution layer (RDL).Documents
No documents
BRUKER
FilmTek 2000M TSV
Verified
CATEGORY
Packaging
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82042
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BRUKER
FilmTek 2000M TSV
CATEGORY
Packaging
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82042
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Film Thickness MeasuremenyConfiguration
No ConfigurationOEM Model Description
The FilmTek™ 2000M TSV metrology system provides an unmatched combination of speed and accuracy for advanced semiconductor packaging applications. This system delivers best-in-class measurement performance and precision for high-throughput measurements for various packaging processes and related structures, including characterizing resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, and redistribution layer (RDL).Documents
No documents