Description
Flip Chip Bond/Reflow (TCB) [oS]Configuration
No ConfigurationOEM Model Description
Multi-Purposes Precision Pick & Place Tool The NUCLEUS is one of the ASMPT’s latest advanced packaging solutions for precision placement. It is designed to address different fan-out assembly approaches such as die-up or die-down with local and/or global alignment modes. The NUCLEUS is capable of fully automated multi-die bond processing with its large work holder for 12” wafer substrate and up to 330 x 330mm panel substrate, making it ideal for wafer level packaging and panel level packaging. Apart from high throughput, the NUCLEUS also provides high bonding accuracy with a XY placement accuracy of less than 2.5µm at 3σ. The NUCLEUS comes with an optional feature which provides an additional processing capability for high bond force and bond temperature catering to a specific process requirement of high-end device application.Documents
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ASMPT
NUCLEUS
CATEGORY
Packaging
Last Verified: 24 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
151389
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Flip Chip Bond/Reflow (TCB) [oS]Configuration
No ConfigurationOEM Model Description
Multi-Purposes Precision Pick & Place Tool The NUCLEUS is one of the ASMPT’s latest advanced packaging solutions for precision placement. It is designed to address different fan-out assembly approaches such as die-up or die-down with local and/or global alignment modes. The NUCLEUS is capable of fully automated multi-die bond processing with its large work holder for 12” wafer substrate and up to 330 x 330mm panel substrate, making it ideal for wafer level packaging and panel level packaging. Apart from high throughput, the NUCLEUS also provides high bonding accuracy with a XY placement accuracy of less than 2.5µm at 3σ. The NUCLEUS comes with an optional feature which provides an additional processing capability for high bond force and bond temperature catering to a specific process requirement of high-end device application.Documents
No documents