
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
sophisticated system providing total solution on sorting, six-side inspection and flexibility for an individual unit testing and laser marking. Applications include wafer level packages / dice inspection comprising micro crack inspection at six sides and sorting according to wafer mapping generated from the upstream processes.Documents
No documents
Verified
CATEGORY
Packaging
Last Verified: 19 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
146071
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT / DEK
SUNBIRD
CATEGORY
Packaging
Last Verified: 19 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
146071
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
sophisticated system providing total solution on sorting, six-side inspection and flexibility for an individual unit testing and laser marking. Applications include wafer level packages / dice inspection comprising micro crack inspection at six sides and sorting according to wafer mapping generated from the upstream processes.Documents
No documents