Description
No descriptionConfiguration
Manual Loading / up to an 8" round substrate x 1.2" deep. (9.5" x 9.5" x 1") Typical Capacity: Can accommodate die or special devices through manual loading Chamber is 4",6",8" compatible Up to three (3) 8" wafers with a special holder Up to three (3) 6" wafers with a special holder (Heated) (0-10torr) Fully Integrated Inductively Coupled Downstream Plasma Source for surface modification and cleaning Includes Gate Valve Isolation of Plasma Source Electronic Mass Flow Controller for Plasma Source gas control - Oxygen 13.56MHzOEM Model Description
Molecular Vapor Deposition SystemDocuments
No documents
SPTS / APPLIED MICROSTRUCTURES
MVD 100
Verified
CATEGORY
MVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101796
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SPTS / APPLIED MICROSTRUCTURES
MVD 100
CATEGORY
MVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101796
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Manual Loading / up to an 8" round substrate x 1.2" deep. (9.5" x 9.5" x 1") Typical Capacity: Can accommodate die or special devices through manual loading Chamber is 4",6",8" compatible Up to three (3) 8" wafers with a special holder Up to three (3) 6" wafers with a special holder (Heated) (0-10torr) Fully Integrated Inductively Coupled Downstream Plasma Source for surface modification and cleaning Includes Gate Valve Isolation of Plasma Source Electronic Mass Flow Controller for Plasma Source gas control - Oxygen 13.56MHzOEM Model Description
Molecular Vapor Deposition SystemDocuments
No documents