Description
No descriptionConfiguration
Tool is currently still in production. Tool is in good condition. Inspect to confirm configuration and condition. <b>C2 Dual Sequel Shrink</b> Electrical Requirements: 208 VAC, 3 phase, 5-wire Wafer Size (inches) : 8 Wafer Type : Notch Stand Alone Install RF Generator Rack SSD Serial Numbers: Module A : DCVD Serial Number : 01-8-C26291 Module B : DCV2 Serial Number : 01-12-C26315 DLCM Serial Number : 02-15-C26440 <b>DLCM</b> Signal Lamp Tower IOC Version : 4.2 Integrated SMIF SMIF Loader Make/Model : Asyst SMIF, LPI 2200 MAG 7 Robot Type SECS / GEMS <b>Sequel Chambers </b> Process Type : AHM Digital Dynamics IOC Heated Valves Gate Valve Mfg & Model : Gate Valve Assy, Heated 4 Inch. Novellus RF Match Type : A.E. End Point Detector RF Generators Advanced Energy RFG5500 Advanced Energy PDX1400 <b>Pumps </b> Deposition Chamber Pump: Alcatel ADS 1202P Load Lock Pump: Alcatel A100L Transfer Chamber Pump: Alcatel A100L <b>Gas Box Configuration</b> Gas Line # Gas Flow (sccm) MFC Mfgr. MFC Model 1 SiH4 750 Horiba Z512 2 N2 10000 Unit UFC1661 3 C2H2 5000 Horiba Z512 4 He 10000 Unit UFC1661 5 NH3 8000 Unit UFC1661 6 He 10000 Unit UFC1661 7 O2 15000 Unit UFC1661 8 NF3 2000 Unit UFC1661 9 N2O 20000 Unit UFC1661 10 N2 15000 Unit UFC1661OEM Model Description
The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.Documents
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2" DUAL SEQUEL
Verified
CATEGORY
MOCVD
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
18871
Wafer Sizes:
8"/200mm
Vintage:
2010
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2" DUAL SEQUEL
Verified
CATEGORY
MOCVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
18871
Wafer Sizes:
8"/200mm
Vintage:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Tool is currently still in production. Tool is in good condition. Inspect to confirm configuration and condition. <b>C2 Dual Sequel Shrink</b> Electrical Requirements: 208 VAC, 3 phase, 5-wire Wafer Size (inches) : 8 Wafer Type : Notch Stand Alone Install RF Generator Rack SSD Serial Numbers: Module A : DCVD Serial Number : 01-8-C26291 Module B : DCV2 Serial Number : 01-12-C26315 DLCM Serial Number : 02-15-C26440 <b>DLCM</b> Signal Lamp Tower IOC Version : 4.2 Integrated SMIF SMIF Loader Make/Model : Asyst SMIF, LPI 2200 MAG 7 Robot Type SECS / GEMS <b>Sequel Chambers </b> Process Type : AHM Digital Dynamics IOC Heated Valves Gate Valve Mfg & Model : Gate Valve Assy, Heated 4 Inch. Novellus RF Match Type : A.E. End Point Detector RF Generators Advanced Energy RFG5500 Advanced Energy PDX1400 <b>Pumps </b> Deposition Chamber Pump: Alcatel ADS 1202P Load Lock Pump: Alcatel A100L Transfer Chamber Pump: Alcatel A100L <b>Gas Box Configuration</b> Gas Line # Gas Flow (sccm) MFC Mfgr. MFC Model 1 SiH4 750 Horiba Z512 2 N2 10000 Unit UFC1661 3 C2H2 5000 Horiba Z512 4 He 10000 Unit UFC1661 5 NH3 8000 Unit UFC1661 6 He 10000 Unit UFC1661 7 O2 15000 Unit UFC1661 8 NF3 2000 Unit UFC1661 9 N2O 20000 Unit UFC1661 10 N2 15000 Unit UFC1661OEM Model Description
The NOVELLUS CONCEPT TWO DUAL SEQUEL is a system that uses reactive ion-beam deposition to deposit thick films onto wafers. It has two process chambers that can provide the throughput power of twelve stations, resulting in dramatic improvements in productivity for these types of films. It is designed for high throughput deposition of thick films, such as layers before CMP (chemical-mechanical planarization), and dual layer passivation films. It also offers dual-beam operation for increased wafer-to-wafer uniformity and higher deposition rates, as well as process control capabilities and versatile materials handling for a wide range of applications.Documents
No documents
Similar Listings
View AllNo Similar Listings