Description
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.Configuration
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEM Model Description
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SONIX
QUANTUM 350
Verified
CATEGORY
Microscope
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
55840
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SONIX
QUANTUM 350
CATEGORY
Microscope
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
55840
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.Configuration
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEM Model Description
None ProvidedDocuments
No documents