Overview

The FAaST 300 SL system is a non-contact electrical metrology system that combines both Micro and Macro corona-Kelvin methods into a single platform. It is designed to support advanced R&D as well as high-volume manufacturing environments. The system features automatic robotic wafer handling, dual FOUP Loadport, and is suitable for patterned wafer and monitor wafer measurements. It uses Semilab SDI’s patented high-resolution Micro corona-Kelvin based on Kelvin Probe Force Microscopy (KPFM) for measurement of dielectric and interface properties. The system also includes an advanced 2-step Non-Visual Defect (NVD) Inspection that combines full wafer Macro surface voltage imaging and focused high-resolution intra-die surface voltage imaging using KPFM. The FAaST software package includes Measurement, Recipe Writing, and Data Viewing applications. The system is suitable for measurement on semiconductors with high-k and low-k dielectric films, and is available in a default configuration for 300mm wafers or with an option for 200mm/300mm bridge configuration. Additional options include a Mini-environment, 300mm Semi compliant Automation, Seismic brackets, wafer OCR, RFID, cassette barcode reader, and a 1000V Vcpd measurement range.