FSM / FRONTIER SEMICONDUCTOR

FSM-128

8800

500TC

128NT

Film stress and wafer bow measurement for wafers up to 300mm diameter. 2D/3D stress mapping standard. Semi-automated system with convenient wafer loading and retrieval.

FSM-128L

Micro Raman system  for lattice level strain and material composition measurement. High spectral resolution (0.02 cm-1) and sub micron lateral resolution. Measurement of through silicon via (TSV) keep out zone, local stress and composition profiling.  Fully automated C2C system.

RAMAN 360

Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.

FSM127

FSM128LC2C	

Thickness and total thickness variation (TTV) mapping system. TTV and Thickness of wafer substrate, thick layers, wafers on tape, bonded wafers, etc. Fully automated cassette to cassette system, SECS/GEM compliant. Warp, Roughness, and Thin Film Thickness measurement options.

FSM / FRONTIER SEMICONDUCTOR

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Top FSM / FRONTIER SEMICONDUCTOR Metrology

FSM-128

8800

500TC

FSM-128L

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