GENUS

8710

Silicon Nitride Deposition - Applied offers a single-wafer, high-temperature system to deposit silicon nitride films, called the SiNgen™ Centura. This system operates at a lower deposition temperature than conventional methods to minimize the amount of time the wafer is exposed to high temperatures and to reduce particles while improving many areas of operating cost and productivity in critical transistor nitride layers for sub-0.18 micron devices.

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

CENTURA SINGEN

8720

The c.VERTICOO 200 is a high-volume furnace that features a unique single-tube setup. It integrates dual boat logistics and fully automated carrier-to-carrier wafer handling, ensuring maximum throughput. The system is capable of handling batch sizes of up to 150 wafers, making it an efficient solution for high-volume wafer processing.

LPCVD Poly

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8710

CENTURA SINGEN

8720

c.VERTICOO 200