The xR LEAP is the industry’s first sub-keV ion implanter that utilizes patented differential lens technology to achieve beam currents as low as 200eV. This paves the way for ultra-shallow junction development required in advanced 0.18µm and 0.13µm devices. The enhancements built into the xRS Series implanters result in higher throughput, with 235 wafers per hour for 200mm and 220 wafers per hour for 300mm, and lower cost of ownership.

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

xR LEAP

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