Overview

The JetStep S Series is designed for rectangular substrates (panels). Both systems boast a large printable field to maximize throughput while not limiting resolution. High-fidelity optics are able to image the fine features required while at the same time managing the non-flatness that is typical for advanced packaging applications. The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling. It incorporates the largest available exposure field with resolution capability to 2/2 and options for increased resolution to 1/1.