The VB300 targets nano-lithography e-beam direct write and next-generation mask applications, Vistec said, with the ability to load from piece parts as small as 5mm to full 300mm wafers with corresponding mask plate substrate sizes.

KLA-Tencor Corporation announced that it has completed its acquisition of the Microelectronic Inspection Equipment (MIE) business unit of Vistec Semiconductor Systems. 
Vistec Semiconductor Systems - MIE provides advanced semiconductor mask and wafer manufacturing systems. 

On February of 2006, Leica Microsystems' Semiconductor Equipment Division has a new name: Vistec Semiconductor Systems. The name change is a result Golden Gate Capital takeover of Leica's semiconductor business.

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