8000

5200

4210

5390

MM 5800

4573

 Thick film resistor trimming, thin film resistor trimming, capacitor trimming, functional or "active" trimming.

9850 

REDSTONE XP

9100

4300R

5970

8000C

5330 FLEX

5330

3570

ACCUSCRIBE 2600

ACCUSCRIBE 2210

5330NS

9835

4410

5530

NWR 213

RedStone™ delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

RedStone

M 4210

High Speed Flex-PCB Laser 

Highest throughput and via quality
esiFlex™ nanosecond UV laser
Advanced tertiary positioning at up to 10,000 mm/s



CapStone

ACCULAZE SS40

4570

3571

5950

5150

4990

4571

5330XI

ICP 5330

ACCULAZE SS10

LT2200

 QuikLaze 50ST2 is a laser cutting solution tool designed specifically for quick, easy removal of a variety of materials. Multiple, user selectable wavelengths provide the capability to selectively remove certain materials
while leaving others unaffected.

QUICKLAZE 50ST2

M 4300

3572

3573

5320

9300

5210

9835UV

5220

ML 5900NS

M 9275

MF 44

4572

M 9850

M9830

M9825

The ESI 9350 is a high-performance Laser Semiconductor Processing System designed to deliver exceptional results in terms of throughput, yield, and uptime. It utilizes a patented 1.3 µm wavelength laser, which enables precise processing of metal memory link materials. This unique feature allows for higher energy levels to be used, resulting in cleaner link cuts without damaging the surrounding silicon, leading to improved yields. The Model 9350 also offers high-accuracy positioning and continuous wafer processing capabilities, ensuring precise and efficient semiconductor manufacturing.

9350

The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. 
Capable of processing new generations of tight pitch fuses

Designed for high volume, automated 300 mm production

Wide range of processing applications – Poly Si, Al, and Cu capable

New high-performance laser option

9820

The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.

9830

ICP 5530

ACCUSCRIBE 2112

ACCUSCRIBE SS40

HD 9830

5335

9825

ACCUSCRIBE 2150

HDE 9830

IR9850

6100

ACCUSCRIBE TITAN

9275

5335xi

The 9850UV produces a 0.8-micron spot size by utilizing ESI’s new 100-kHz UV laser, which was developed specifically for advanced DRAM and NAND Flash applications.

9850UV

ESI

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REDSTONE XP

RedStone

NWR 213

M 4210

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