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The ESI 9350 is a high-performance Laser Semiconductor Processing System designed to deliver exceptional results in terms of throughput, yield, and uptime. It utilizes a patented 1.3 µm wavelength laser, which enables precise processing of metal memory link materials. This unique feature allows for higher energy levels to be used, resulting in cleaner link cuts without damaging the surrounding silicon, leading to improved yields. The Model 9350 also offers high-accuracy positioning and continuous wafer processing capabilities, ensuring precise and efficient semiconductor manufacturing.
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