Description
No descriptionConfiguration
Minimum Spot Size (1/e2): 2.0μm Accuracy: .20μm Wavelength: 1.3μm – LightWave Laser rep rate: 30kHz Maximum cut velocity: 200mm/second Wafer Diameter 200mm / 300mm.(S‐type for 150mm)OEM Model Description
The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. Capable of processing new generations of tight pitch fuses Designed for high volume, automated 300 mm production Wide range of processing applications – Poly Si, Al, and Cu capable New high-performance laser optionDocuments
No documents
ESI
9820
Verified
CATEGORY
Laser
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
105420
Wafer Sizes:
6"/150mm, 8"/200mm, 12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ESI
9820
CATEGORY
Laser
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
105420
Wafer Sizes:
6"/150mm, 8"/200mm, 12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Minimum Spot Size (1/e2): 2.0μm Accuracy: .20μm Wavelength: 1.3μm – LightWave Laser rep rate: 30kHz Maximum cut velocity: 200mm/second Wafer Diameter 200mm / 300mm.(S‐type for 150mm)OEM Model Description
The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. Capable of processing new generations of tight pitch fuses Designed for high volume, automated 300 mm production Wide range of processing applications – Poly Si, Al, and Cu capable New high-performance laser optionDocuments
No documents