Description
Laser SawConfiguration
No ConfigurationOEM Model Description
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.Documents
No documents
ASMPT
LASER1205
Verified
CATEGORY
Laser
Last Verified: 22 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113834
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASMPT
LASER1205
CATEGORY
Laser
Last Verified: 22 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113834
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Laser SawConfiguration
No ConfigurationOEM Model Description
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.Documents
No documents