Description
Dielectric Characterization Tool with COCOS & Epi-t for up to 300mm Wafers, Parts OnlyConfiguration
No ConfigurationOEM Model Description
The SEMILAB FAaST 330 is an electrical metrology system that uses non-contact methods to measure the properties of materials. It combines two patented techniques, known as Micro and Macro corona-Kelvin methods, into one platform. This system is designed to support both advanced research and development and high-volume manufacturing environments. The FAaST 330/230 DSPV systems provide fast, non-contact monitoring of heavy metal contamination in wafers, with the ability to detect even very low levels of contamination. The FAaST 330/230 C-V / I-V systems use advanced measurement techniques to provide non-contact imaging of dielectric and interface properties on monitor wafers. These systems include automated wafer handling and are suitable for medium to high-volume manufacturing environments.Documents
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SEMILAB
FAAST 330
Verified
CATEGORY
Metrology
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
54830
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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SEMILAB
FAAST 330
Verified
CATEGORY
Metrology
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
54830
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Dielectric Characterization Tool with COCOS & Epi-t for up to 300mm Wafers, Parts OnlyConfiguration
No ConfigurationOEM Model Description
The SEMILAB FAaST 330 is an electrical metrology system that uses non-contact methods to measure the properties of materials. It combines two patented techniques, known as Micro and Macro corona-Kelvin methods, into one platform. This system is designed to support both advanced research and development and high-volume manufacturing environments. The FAaST 330/230 DSPV systems provide fast, non-contact monitoring of heavy metal contamination in wafers, with the ability to detect even very low levels of contamination. The FAaST 330/230 C-V / I-V systems use advanced measurement techniques to provide non-contact imaging of dielectric and interface properties on monitor wafers. These systems include automated wafer handling and are suitable for medium to high-volume manufacturing environments.Documents
No documents