Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The SEMILAB FAaST 330 is an electrical metrology system that uses non-contact methods to measure the properties of materials. It combines two patented techniques, known as Micro and Macro corona-Kelvin methods, into one platform. This system is designed to support both advanced research and development and high-volume manufacturing environments. The FAaST 330/230 DSPV systems provide fast, non-contact monitoring of heavy metal contamination in wafers, with the ability to detect even very low levels of contamination. The FAaST 330/230 C-V / I-V systems use advanced measurement techniques to provide non-contact imaging of dielectric and interface properties on monitor wafers. These systems include automated wafer handling and are suitable for medium to high-volume manufacturing environments.Documents
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SEMILAB
FAAST 330
Verified
CATEGORY
Metrology
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
36175
Wafer Sizes:
Unknown
Vintage:
1999
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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SEMILAB
FAAST 330
Verified
CATEGORY
Metrology
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
36175
Wafer Sizes:
Unknown
Vintage:
1999
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The SEMILAB FAaST 330 is an electrical metrology system that uses non-contact methods to measure the properties of materials. It combines two patented techniques, known as Micro and Macro corona-Kelvin methods, into one platform. This system is designed to support both advanced research and development and high-volume manufacturing environments. The FAaST 330/230 DSPV systems provide fast, non-contact monitoring of heavy metal contamination in wafers, with the ability to detect even very low levels of contamination. The FAaST 330/230 C-V / I-V systems use advanced measurement techniques to provide non-contact imaging of dielectric and interface properties on monitor wafers. These systems include automated wafer handling and are suitable for medium to high-volume manufacturing environments.Documents
No documents