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Description
500 DEG C, REBUILT VALVES AND VACUUM PUMP VACUUM BELOW 50 MILLITORR PRESSURES EXCEEDING 50 PSIConfiguration
No ConfigurationOEM Model Description
The Model 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed off-line. The system is used in both production and research environments for flux-free soldering, brazing, annealing and glass sealing of components and packages for microelectronic applications.Documents
No documents
PREFERRED
SELLER
CATEGORY
Furnaces / Diffusion
Last Verified: 29 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
124174
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
SCIENTIFIC SEALING TECHNOLOGY / SST
3130
CATEGORY
Furnaces / Diffusion
Last Verified: 29 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
124174
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
500 DEG C, REBUILT VALVES AND VACUUM PUMP VACUUM BELOW 50 MILLITORR PRESSURES EXCEEDING 50 PSIConfiguration
No ConfigurationOEM Model Description
The Model 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed off-line. The system is used in both production and research environments for flux-free soldering, brazing, annealing and glass sealing of components and packages for microelectronic applications.Documents
No documents