Description
No descriptionConfiguration
DIFFOEM Model Description
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.Documents
No documents
Verified
CATEGORY
Furnaces / Diffusion
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
107409
Wafer Sizes:
12"/300mm
Vintage:
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
AVIZA / SVG / THERMCO
RVP-300plus
CATEGORY
Furnaces / Diffusion
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
107409
Wafer Sizes:
12"/300mm
Vintage:
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
DIFFOEM Model Description
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.Documents
No documents