Description
Repair needed - Z axis bond head not moving Any spare parts sets?: YesConfiguration
No ConfigurationOEM Model Description
Flip Chip BonderDocuments
No documents
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
Verified
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111137
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllSEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111137
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Repair needed - Z axis bond head not moving Any spare parts sets?: YesConfiguration
No ConfigurationOEM Model Description
Flip Chip BonderDocuments
No documents