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Description
Repair needed - Z axis bond head not moving Any spare parts sets?: YesConfiguration
No ConfigurationOEM Model Description
Flip Chip BonderDocuments
No documents
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111137
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111137
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Repair needed - Z axis bond head not moving Any spare parts sets?: YesConfiguration
No ConfigurationOEM Model Description
Flip Chip BonderDocuments
No documents