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Description
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FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM Model Description
Flip Chip BonderDocuments
No documents
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Installed / Running
Product ID:
110112
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Installed / Running
Product ID:
110112
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM Model Description
Flip Chip BonderDocuments
No documents