Description
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FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM Model Description
Flip Chip BonderDocuments
No documents
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
Verified
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Installed / Running
Product ID:
110112
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllSEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Installed / Running
Product ID:
110112
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM Model Description
Flip Chip BonderDocuments
No documents