
Description
No descriptionConfiguration
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM Model Description
Flip Chip BonderDocuments
No documents
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Installed / Running
Product ID:
110112
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Installed / Running
Product ID:
110112
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM Model Description
Flip Chip BonderDocuments
No documents