Description
DIE_BONDER 4 inch tray supply, heat compression bondingConfiguration
No ConfigurationOEM Model Description
Flip Chip BondersDocuments
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PANASONIC
FCB3
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
132754
Wafer Sizes:
Unknown
Vintage:
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
DIE_BONDER 4 inch tray supply, heat compression bondingConfiguration
No ConfigurationOEM Model Description
Flip Chip BondersDocuments
No documents