Description
Universal BonderConfiguration
No ConfigurationOEM Model Description
Universal Flip Chip Die Bonder - most versatile semi-automatic Flip-Chip PlatformDocuments
No documents
JFP MICROTECHNIC
PP6
Verified
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
70562
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
JFP MICROTECHNIC
PP6
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
70562
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Universal BonderConfiguration
No ConfigurationOEM Model Description
Universal Flip Chip Die Bonder - most versatile semi-automatic Flip-Chip PlatformDocuments
No documents