Description
Used for die attach bonding Complete, working condition. Optics: Field of view: 3.8mm x 2.7mm (general) Optical resolution: 1μm/px Accuracy: Placement: 0.3μm @ 3 Sigma Alignment: 0.08μm Alignment camera with pattern recognition FOV 3mmx4mmConfiguration
UV Curing Module (3355-23) Dispense Module Laser Height Sensor Bond Force: 0.2N-15NOEM Model Description
None ProvidedDocuments
No documents
Verified
CATEGORY
Flip Chip Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
150786
Wafer Sizes:
Unknown
Vintage:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FINETECH INC
FINEPLACER femto 2
CATEGORY
Flip Chip Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
150786
Wafer Sizes:
Unknown
Vintage:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Used for die attach bonding Complete, working condition. Optics: Field of view: 3.8mm x 2.7mm (general) Optical resolution: 1μm/px Accuracy: Placement: 0.3μm @ 3 Sigma Alignment: 0.08μm Alignment camera with pattern recognition FOV 3mmx4mmConfiguration
UV Curing Module (3355-23) Dispense Module Laser Height Sensor Bond Force: 0.2N-15NOEM Model Description
None ProvidedDocuments
No documents