Datacon Technology is a manufacturer of flip chip bonding, multichip die bonding and other related assembly equipment.

BESI / DATACON

The 8800 CHAMEO is a multi-chip flip chip platform that enables single pass production for higher accuracy and yield. It provides advanced interconnection options such as heated bond heads and work holders, ultrasonic, thermosonic, and thermocompression options, as well as wafer chucks for chip-to-wafer bonding. Key features include multichip capability, single pass production, waffle pack feeders, ultrasonic, thermosonic, and thermo-compression options, lead frame, strip, boat, and wafer substrates, and customized features. The 8800 CHAMEO also boasts the highest accuracy of ± 6µm @ 3 Sigma for fine-pitch and TSV applications, local reflow for sophisticated assemblies, and long-term stability for high yield at high speed. Wafer level applications include fan-out wafer level packages, advanced chip to wafer, and through silicon vias (TSV).

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

BESI / DATACON

8800 CHAMEO

Flip Chip Bonders

Similar Listings

BESI / DATACON

8800 CHAMEO

BESI / DATACON

8800 CHAMEO

8800 CHAMEO

Flip Chip Bonders

Similar Listings

BESI / DATACON

8800 CHAMEO

BESI / DATACON

8800 CHAMEO