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8800 TC advanced
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Flip Chip BondersOverview
The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept with total process control, advanced capabilities and unsurpassed production stability. With its unique and complete new Advanced Hardware architecture, unique 7-Axis Bond head and Advanced Process capabilities, the Datacon 8800 TC advanced is the essential tool of reference of current TSV applications. FlipChip Bonder
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