Description
ESEC MICRON2 ESEC MICRON2 [ALI]Configuration
No ConfigurationOEM Model Description
FlipChip BonderDocuments
No documents
Verified
CATEGORY
Flip Chip Bonders
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
137895
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
MICRON 2
CATEGORY
Flip Chip Bonders
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
137895
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ESEC MICRON2 ESEC MICRON2 [ALI]Configuration
No ConfigurationOEM Model Description
FlipChip BonderDocuments
No documents