Description
Die Bonder / Flip Chip Bonder Dual HeadConfiguration
Die Bonding machine for passive alignment accuracy less than 1um placementOEM Model Description
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-controlDocuments
No documents
Verified
CATEGORY
Flip Chip Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
149015
Wafer Sizes:
Unknown
Vintage:
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASMPT
AMICRA NOVA PLUS
CATEGORY
Flip Chip Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
149015
Wafer Sizes:
Unknown
Vintage:
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Die Bonder / Flip Chip Bonder Dual HeadConfiguration
Die Bonding machine for passive alignment accuracy less than 1um placementOEM Model Description
The NOVA Plus High Speed Dual Head Die Bonder & Flip Chip Bonder offers a wide range of features including: -High precision die bonder/flip chip bonder -Accuracy +/-2.5m @ 3 sigma -Cycle-time of < 3 sec* -Modular machine concept for all micro assembly applications -Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing -Multi flip chip bonding -Wafer mapping -Post bond inspection/measurement -Substrate working area of 550x600mm -Active bond-force-controlDocuments
No documents