Description
Die Bonder / Flip Chip Bonder Single BondConfiguration
Die Bonding machine for passive alignment Eutectic process (Laser melt) with Silicon substates accuracy less than 1um placementOEM Model Description
None ProvidedDocuments
No documents
Verified
CATEGORY
Flip Chip Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
149014
Wafer Sizes:
Unknown
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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CATEGORY
Flip Chip Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
149014
Wafer Sizes:
Unknown
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Die Bonder / Flip Chip Bonder Single BondConfiguration
Die Bonding machine for passive alignment Eutectic process (Laser melt) with Silicon substates accuracy less than 1um placementOEM Model Description
None ProvidedDocuments
No documents