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36slot head system, up800*5(128ch*5) DCIO*1, BBAC*1OEM Model Description
The UltraFLEX-HD is the newest member of the UltraFLEX family of test systems, optimized for testing high-performance digital and SoC devices. It delivers the power and precision needed for testing advanced microprocessors, PC chipsets and graphics, disk drives, video game devices, System on a Chip (SoC) or System in Package (SiP), memory, baseband digital, network, and broadband. The UltraFLEX-HD achieves lower cost of test through faster test times and higher parallel efficiency, all in a small 2m x 2m footprint.Documents
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TERADYNE
UFLEX-HD
Verified
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
27147
Wafer Sizes:
Unknown
Vintage:
Unknown
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TERADYNE
UFLEX-HD
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
27147
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
36slot head system, up800*5(128ch*5) DCIO*1, BBAC*1OEM Model Description
The UltraFLEX-HD is the newest member of the UltraFLEX family of test systems, optimized for testing high-performance digital and SoC devices. It delivers the power and precision needed for testing advanced microprocessors, PC chipsets and graphics, disk drives, video game devices, System on a Chip (SoC) or System in Package (SiP), memory, baseband digital, network, and broadband. The UltraFLEX-HD achieves lower cost of test through faster test times and higher parallel efficiency, all in a small 2m x 2m footprint.Documents
No documents