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PART: BBAC (UltraFLEX) P/N:974-214-01/02OEM Model Description
Also known as UltraFLEX. Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.Documents
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TERADYNE
UFLEX
Verified
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Parts Tool
Operational Status:
Unknown
Product ID:
83502
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
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Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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TERADYNE
UFLEX
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Parts Tool
Operational Status:
Unknown
Product ID:
83502
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
PART: BBAC (UltraFLEX) P/N:974-214-01/02OEM Model Description
Also known as UltraFLEX. Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.Documents
No documents