Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Device type: BGA, CSP, QFN, QFP, SQFP, TSOP Device size: 2x2~50X50 (mm) (Depends on condition) Device thickness: 0.6~5.0 (mm) Temp range: Up to 150 degrees Max contact force: 85kgf (225kgf option) Index time: Less than 0.35sec UPH: 8500 Test Site: Single, Dual, Quad, Octal Jam rate: 1/20000Documents
No documents
SYNAX
S9
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
120146
Wafer Sizes:
Unknown
Vintage:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Device type: BGA, CSP, QFN, QFP, SQFP, TSOP Device size: 2x2~50X50 (mm) (Depends on condition) Device thickness: 0.6~5.0 (mm) Temp range: Up to 150 degrees Max contact force: 85kgf (225kgf option) Index time: Less than 0.35sec UPH: 8500 Test Site: Single, Dual, Quad, Octal Jam rate: 1/20000Documents
No documents