Description
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Heat plate type - yes Specifications: NS-8040 Device Type: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA Min. 3 x 3 to Max. 50 x 50 (Lead pitch: 0.4 mm or more)*1 Testing Mode: Square 4-site (2 x 2) In-Line 4-site (4 x 1) 2-site Busy Shuttle (Single) Testing Area: 184 mm x 130 mm Standard Socket Pitch (mm): X: 80 Y: 60 Heating Method: Heating Plate Index Time: 0.39 sec or more (Ambient/High temperature) *2 Throughput: 8000 Tray Classification: Max. 6 classification (3 auto loaders, 3 manual loaders) Tray: JEDEC (135.9X315.0) mm Temperature Accuracy: '+50degC to +90degC +2degC *3 '+90degC to 130degC +3degC *3 Single phase AC 200 to 240 V 50/60 Hz 6kVA Power: 1700 (W) X1500 (D) X1760 (H) *4 Weight: Approx. 920 kgOEM Model Description
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SEIKO / EPSON
NS 8040
Verified
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113946
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
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Available
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SEIKO / EPSON
NS 8040
CATEGORY
Final Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
113946
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available