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Wet Etch

The CELLESTA™ -i MD is a TEL's most advanced 300mm single wafer clean system for 10nm technology node and beyond. The system has state-of-the-art cleaning capability which enables damage less clean of the well-patterned wafer surface and damage free particle removal. Pattern collapse free drying technology is also realized by implements of both chamber atmosphere control and performance improvement of IPA dispenser. The system has achieved higher productivity and lower running cost with the use of newly developed chemical recycle concept. The CELLESTA™- i MD offers scalability and will strongly support the establishment of the most challenging wafer surface clean process technologies using various chemicals for Cu and other metal exposed layer of next generation devices.\ 300mm wafer cleaning system, wet etch, uses IPA dry with new method, can hold up to 20 cleaning chambers, 1000 wph throughput.

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