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The UNITY Me is an etching system designed for the 200-mm wafer mass-production line. It boasts excellent cost performance, resulting in higher productivity and reliability. With a range of chamber applications, the UNITY Me delivers top-level productivity across a wide range of process areas, including HARC, Dual Damascene, low-k dielectrics, and poly gate. Some of the features of the UNITY Me include support for DRM and SCCM chambers, a maximum four-chamber capability, high throughput, a compact design, lower CoO, ease of maintenance, and a Flow Control System. With these features, the UNITY Me is a versatile and efficient etching system that can meet the needs of various production processes.

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