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Plasma Etch

UNITY™ Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM™, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools. Unity ME was originally made in Mass. But moved to Japan, supported 3 chambers and an ash or other small unit. Originally 200mm, some were converted to 300mm. TEL now manufactures this system again for 100-300mm.

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